Application of Graphene Silicone Grease in heat dissipation for the Intel Core i5 Processor

Phuong Mai - Vietnam Academy of Science and Technology, Hanoi, Vietnam
Tuan Bui - Vietnam Academy of Science and Technology, Hanoi, Vietnam
Hau Tran - Vietnam Academy of Science and Technology, Hanoi, Vietnam
Trinh Pham - Vietnam Academy of Science and Technology, Hanoi, Vietnam
Dinh Nguyen - VNU University of Engineering and Technology, Ha Noi, Vietnam
Minh Phan - Vietnam Academy of Science and Technology, Hanoi, Vietnam
Thang Bui - Vietnam Academy of Science and Technology, Hanoi, Vietnam

Citation Format:



Graphene was known as the material that owning many superiority properties and high thermal conductivity. Thermal conductivity of single-layer graphene was up to 5200 W/mK (compared to the thermal conductivity of Carbon nanotubes 2000 W/mK and Silver 410 W/mK). This had suggested that graphene is the most potential material for heat dissipation applications for electronic devices, such as a computer microprocessor, high power LED... To enhance the dispersion of the GNPs silicone matrix, we were functionalized graphene nanoplatelets (GNPs) with carboxyl (-COOH) groups. The silicone thermal greases containing GNPs were prepared by High- Energy Ball Milling method (8000D Mixer /Mill). The results of SEM, FTIR, Raman showed the presence of the carboxyl groups in GNPs and GNPs uniform dispersion dispersed in grease. The results of thermal conductivity from Transient Hot Bridge THB-100 showed that thermal conductivity enhancement was up to 234 % with Gr-COOH 1.0 vol.%. Thermal grease is used as a thermal interface material to coolants for Intel Core i5 processor. The results of thermal dissipation efficiency shown the saturation temperature of the processor using thermal grease containing 1.0 vol.% Gr-COOH decreased 4℃, compared to the silicone grease.


thermal grease, silicone grease, graphene, CPU, Intel Core i5 processor

Full Text:



P. K. Schelling, L. Shi, and K. E. Goodson, “Managing heat for electronics,” Mater. Today, vol. 8, no. 6, pp. 30–35, Jun. 2005.

K. M. Razeeb, E. Dalton, G. L. W. Cross, and A. J. Robinson, “Present and future thermal interface materials for electronic devices,” Int. Mater. Rev., vol. 63, no. 1, pp. 1–21, Jan. 2018.

N. T. Hong, K. H. Koh, N. T. T. Tam, P. N. Minh, P. H. Khoi, and S. Lee, “Combined model for growing mechanism of carbon nanotubes using HFCVD: effect of temperature and molecule gas diffusion,” Thin Solid Films, vol. 517, no. 12, pp. 3562–3565, Apr. 2009.

B. Hung Thang, P. Van Trinh, N. Van Chuc, P. H. Khoi, and P. N. Minh, “Heat Dissipation for Microprocessor Using Multiwalled Carbon Nanotubes Based Liquid,” Sci. World J., vol. 2013, pp. 1–6, 2013.

J. Falck, C. Felgemacher, A. Rojko, M. Liserre, and P. Zacharias, “Reliability of Power Electronic Systems: An Industry Perspective,” IEEE Ind. Electron. Mag., vol. 12, no. 2, pp. 24–35, Jun. 2018.

Y. Song and B. Wang, “Survey on Reliability of Power Electronic Systems,” IEEE Trans. Power Electron., vol. 28, no. 1, pp. 591–604, Jan. 2013.

F. L. Tan and C. P. Tso, “Cooling of mobile electronic devices using phase change materials,” Appl. Therm. Eng., vol. 24, no. 2–3, pp. 159–169, Feb. 2004.

R. L. Webb and J. P. Gwinn, “Low melting point thermal interface material,” in ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258), pp. 671–676.

D. D. L. Chung, “Thermal Interface Materials,” J. Mater. Eng. Perform., vol. 10, no. 1, pp. 56–59, Feb. 2001.

F. Sarvar, D. Whalley, and P. Conway, “Thermal Interface Materials - A Review of the State of the Art,” in 2006 1st Electronic Systemintegration Technology Conference, 2006, pp. 1292–1302.

J. Due and A. J. Robinson, “Reliability of thermal interface materials: A review,” Appl. Therm. Eng., vol. 50, no. 1, pp. 455–463, Jan. 2013.

S. Yeol Jeong and Y. Suk Choi, “Measurement of interfacial thermal resistance of silicone based grease in wide temperature range by laser flash method,” High Temp. Press., vol. 48, no. 1–2, p. 59, 2019.

M. A. Vadivelu, C. R. Kumar, and G. M. Joshi, “Polymer composites for thermal management: a review,” Compos. Interfaces, vol. 23, no. 9, pp. 847–872, Nov. 2016.

D. D. . Chung, “Materials for thermal conduction,” Appl. Therm. Eng., vol. 21, no. 16, pp. 1593–1605, Nov. 2001.

H. Chen, H. Wei, M. Chen, F. Meng, H. Li, and Q. Li, “Enhancing the effectiveness of silicone thermal grease by the addition of functionalized carbon nanotubes,” Appl. Surf. Sci., vol. 283, pp. 525–531, Oct. 2013.

W. Zhou, S. Qi, C. Tu, H. Zhao, C. Wang, and J. Kou, “Effect of the particle size of Al2O3 on the properties of filled heat-conductive silicone rubber,” J. Appl. Polym. Sci., vol. 104, no. 2, pp. 1312–1318, Apr. 2007.

Q. Wang, W. Gao, and Z. Xie, “Highly thermally conductive room-temperature-vulcanized silicone rubber and silicone grease,” J. Appl. Polym. Sci., vol. 89, no. 9, pp. 2397–2399, Aug. 2003.

W. Yu, H. Xie, L. Yin, J. Zhao, L. Xia, and L. Chen, “Exceptionally high thermal conductivity of thermal grease: Synergistic effects of graphene and alumina,” Int. J. Therm. Sci., vol. 91, pp. 76–82, May 2015.

J. Hansson, T. M. J. Nilsson, L. Ye, and J. Liu, “Novel nanostructured thermal interface materials: a review,” Int. Mater. Rev., vol. 63, no. 1, pp. 22–45, Jan. 2018.

U. Eduok, O. Faye, and J. Szpunar, “Recent developments and applications of protective silicone coatings: A review of PDMS functional materials,” Prog. Org. Coatings, vol. 111, pp. 124–163, Oct. 2017.

L. Calabrese, L. Bonaccorsi, A. Freni, and E. Proverbio, “Silicone composite foams for adsorption heat pump applications,” Sustain. Mater. Technol., vol. 12, pp. 27–34, Jul. 2017.

N. Burger, A. Laachachi, M. Ferriol, M. Lutz, V. Toniazzo, and D. Ruch, “Review of thermal conductivity in composites: Mechanisms, parameters and theory,” Prog. Polym. Sci., vol. 61, pp. 1–28, Oct. 2016.

S. Zhai, P. Zhang, Y. Xian, J. Zeng, and B. Shi, “Effective thermal conductivity of polymer composites: Theoretical models and simulation models,” Int. J. Heat Mass Transf., vol. 117, pp. 358–374, Feb. 2018.

P. Zhang, J. Zeng, S. Zhai, Y. Xian, D. Yang, and Q. Li, “Thermal Properties of Graphene Filled Polymer Composite Thermal Interface Materials,” Macromol. Mater. Eng., vol. 302, no. 9, p. 1700068, Sep. 2017.

H. Chen et al., “Thermal conductivity of polymer-based composites: Fundamentals and applications,” Prog. Polym. Sci., vol. 59, pp. 41–85, Aug. 2016.

K. S. Novoselov, “Electric Field Effect in Atomically Thin Carbon Films,” Science (80-. )., vol. 306, no. 5696, pp. 666–669, Oct. 2004.

A. A. Balandin et al., “Superior Thermal Conductivity of Single-Layer Graphene,” Nano Lett., vol. 8, no. 3, pp. 902–907, Mar. 2008.

H. T. Bui, V. C. Nguyen, V. T. Pham, T. T. T. Ngo, and N. M. Phan, “Thermal dissipation media for high power electronic devices using a carbon nanotube-based composite,” Adv. Nat. Sci. Nanosci. Nanotechnol., vol. 2, no. 2, p. 025002, Apr. 2011.

B. H. Thang, P. Van Trinh, L. D. Quang, N. T. Huong, P. H. Khoi, and P. N. Minh, “Heat dissipation for the Intel Core i5 processor using multiwalled carbon-nanotube-based ethylene glycol,” J. Korean Phys. Soc., vol. 65, no. 3, pp. 312–316, 2014.


  • There are currently no refbacks.

Creative Commons License
This work is licensed under a Creative Commons Attribution-ShareAlike 4.0 International License.

JOIV : International Journal on Informatics Visualization
ISSN 2549-9610  (print) | 2549-9904 (online)
Organized by Department of Information Technology - Politeknik Negeri Padang, and Institute of Visual Informatics - UKM and Soft Computing and Data Mining Centre - UTHM
W :
E :,,

View JOIV Stats

Creative Commons License is licensed under a Creative Commons Attribution-ShareAlike 4.0 International License.